Atmel Customer Specific ICs: Process Technology and Libraries

Close Window

Customer Specific ICs

Atmel's process technology development teams work closely with its ASIC design engineers to ensure that process technology is optimized for product requirements. The result is a rich menu of advanced process options that give every product its edge in terms of performance, power consumption and die size. Atmel's process variants include: Mixed analog/digital CMOS with options for high speed or low power consumption, plus a radiation-tolerant option for space applications CMOS with embedded Flash or EEPROM for nonvolatile memory integration These mature technologies have the benefits of reduced NRE costs and process optimization based on a very large number of successful designs. They provide an excellent performance/cost ratio.

Library Process Name Geometry Kgates/mm2 Core Supply IO (Lib) Metal Layers 1-Mbit SRAM 1-Mbit ROM 1-Mbit EEPROM 1-Mbit Flash Analog Low Leakage Availability ATC065 AT91K 65 nm 480 1.0V 1.0V, 2.5V 8 1.0 mm2 0.15 mm2     MiM Yes Now ATC09 AT72K 90 nm 240 1.0V 1.0V, 2.5V 8 2.0 mm2 0.3 mm2     MiM Yes Now ATC09/Flash AT66.9K 90 nm 240 1.0V 1.0V, 2.5V 8 2.0 mm2 0.3 mm2   1.5 mm2 MiM Yes Now ATC13 AT59K 0.13 µm 140 1.2V 1.2V, 3.3V 5 to 8 4.0 mm2 0.6 mm2     MiM Yes Now ATC13/E2 AT59.86K 0.13 µm 140 1.2V 1.2V, 3.3V 5 to 8 4.0 mm2 0.6 mm2 3.0 mm2 2.8 mm2 MiM Yes Now ATC15/E2 AT58.85K 0.15 µm 90 1.8V 1.8V, 3.3V 4 to 6 5.0 mm2 0.8 mm2 3.0 mm2 2.8 mm2 MiM Yes Now ATC18 AT58K 0.18 µm 70 1.8V 1.8V, 3.3V, 5V 4 to 6 6.3 mm2 1.0 mm2     MiM Yes Now ATC18/E2 AT58.8K 0.18 µm 70 1.8V 1.8V, 3.3V 4 to 6 6.3 mm2 1.0 mm2 3.5 mm2 3.4 mm2 MiM Yes Now ATC35 AT56K 0.35 µm 14 3.3V 3.3V, 5V 3 to 4 23 mm2 3.5 mm2     2nd Poly   Now ATC35/E2 AT56.8K 0.35 µm 14 3.3V 3.3V, 5V 3 to 4 23 mm2 3.5 mm2 11 mm2   2nd Poly   Now

Close Window